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 HCC/HCF4095B HCC/HCF4096B
GATE J-K MASTER-SLAVE FLIP-FLOPS
.16MHzTOGGLERATE( .GATEDI .QUI .5V,10VAND15VPARAMETRI .I .100%TESTEDFORQUI .MEETSALLREQUI
DESCRIPTION
typ.) AT VDD - VSS = 10V NPUTS ESCENT CURRENT SPECIFIED TO 20v FOR HCC DEVICE C RATINGS NPUT CURRENTOF 100 nA AT 18V AND 25oC FOR HCC DEVICE ESCENT CURRENT REMENTS OF JEDEC TENTATIVE STANDARD No 13 A, "STANDARD SPECIFICATIONS FOR DESCRIPTION OF B SERIES CMOS DEVICES"
inputs is transferred to the Q and Q outputs on the positive edge of the clock pulse. SET and RESET inputs (active high) are provided for asynchronous operation.
EY (Plastic Package)
F (Ceramic Package)
The HCC4095B/4096B (extended temperature range) and HCF4095B/4096B (intermediate temperature range) are monolithic integrated circuits, available in 14 lead dual in-line plastic or ceramic package and plastic micropackage. The HCC/HCF4095B and HCC/HCF4096B are J-K Master-Slave Flip-Flops featuring separate AND gating of multiple J and K inputs. The gated J-K input control transfer of information into the master section during clocked operation. Information on the J-K PIN CONNECTIONS 4095B
M1 (Micro Package)
C1 (Chip Carrier)
ORDER CODES : HCC40XXBF HCF40XXBM1 HCF40XXBEY HCF40XXBC1
4096B
September 1988
1/13
HCC/HCF4095B HCC/HCF4096B
FUNCTIONAL DIAGRAMS
LOGIC DIAGRAM
TRUTH TABLES SYNCHRONOUS OPERATION (S=0 R=0)
Inputs Before Positive Clock Transition J* 0 0 1 1 K* 0 1 0 1 Outputs After Positive Clock Transition Q No Change 0 1 Toggles 1 0 Q
ASYNCHRONOUS OPERATION (J and K DON'T CARE)
S 0 0 1 1
0 = VSS, 1 = VDD
R 0 1 0 1
Q No Change 0 1 0
Q 1 0 0
* For 4095B J = J1 * J2 *J3, K = K1 *K2 * K3 * For 4095B J = J1 * J2 *J3, K = K1 *K2 * K3
2/13
HCC/HCF4095B HCC/HCF4096B
ABSOLUTE MAXIMUM RATING
Symbol VDD * Vi II Ptot Parameter Supply Voltage: HCC Types HCF Types Input Voltage DC Input Current (any one input) Total Power Dissipation (per package) Dissipation per Output Transistor for Top = Full Package Temperature Range Operating Temperature: HCC Types HCF Types Storage Temperature Value -0.5 to +20 -0.5 to +18 -0.5 to VDD + 0.5 10 200 100 -55 to +125 -40 to +85 -65 to +150 Unit V V V mA mW mW
o o o
Top Tstg
C C C
Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress ratingonly and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for external periods may affect device reliability. * All voltage values are referred to VSS pin voltage.
RECOMMENDED OPERATING CONDITIONS
Symbol VDD VI Top Parameter Supply Voltage: HCC Types HCF Types Input Voltage Operating Temperature: HCC Types HCF Types Value 3 to 18 3 to 15 0 to VDD -55 to +125 -40 to +85 Unit V V V
o o
C C
3/13
HCC/HCF4095B HCC/HCF4096B
STATIC ELECTRICAL CHARACTERISTICS (over recommended operating conditions)
Symbol IL Parameter Quiescent Current VI (V) Test Conditios VO |IO| VDD (V) (A) (V) 5 10 15 20 5 10 15 5 10 15 5 10 15 5 10 15 5 10 15 5 5 10 15 5 5 10 15 5 10 15 5 10 15 18 15 TLOW * Min. Max. 1 2 4 20 4 8 16 4.95 9.95 14.95 0.05 0.05 0.05 3.5 7 11 1.5 3 4 -2 -0.64 -1.6 -4.2 -1.53 -0.52 -1.3 -3.6 0.64 1.6 4.2 0.52 1.3 3.6 0.1 0.3 Value 25 oC Min. Typ. Max. 0.02 1 0.02 2 0.02 4 0.04 20 0.02 4 0.02 8 0.02 16 4.95 9.95 14.95 0.05 0.05 0.05 3.5 7 11 1.5 3 4 -1.6 -3.2 -0.51 -1 -1.3 -2.6 -3.4 -6.8 -1.36 -3.2 -0.44 -1 -1.1 -2.6 -3.0 -6.8 0.51 1 1.3 2.6 3.4 6.8 0.44 1 1.1 2.6 3.0 6.8 10-5 0.1 10-5 0.3 5 7.5 THIGH * Min. Max. 30 60 120 600 30 60 120 4.95 9.95 14.95 0.05 0.05 0.05 3.5 7 11 1.5 3 4 -1.15 -0.36 -0.9 -2.4 -1.1 -0.36 -0.9 -2.4 0.36 0.9 2.4 0.36 0.9 2.4 1 1 Unit
V OH
VOL
VIH
0/5 0/10 0/15 0/20 0/5 HCF 0/10 Types 0/15 Output High 0/5 Voltage 0/10 0/15 Output Low 5/0 Voltage 10/0 15/0 Input High Voltage HCC Types Input Low Voltage Output Drive Current 0/5 0/5 0/10 0/15 0/5 0/5 0/10 0/15 0/5 0/10 0/15 0/5 0/10 0/15 0/18 0/15
A
V IL
IOH
HCC Types
HCF Types IOL Output Sink Current
HCC Types HCF Types
4.5 9 13.5 0.5 1 1.5 2.5 4.6 9.5 13.5 2.5 4.6 9.5 13.5 0.4 0.5 1.5 0.4 0.5 1.5
< < < < < < < < < < < <
1 1 1 1 1 1 1 1 1 1 1 1
V
V
V
V
mA
mA
IIH, IIL CI
Input Leakage Current Input Capacitance
Any Input Any Input
A pF
* TLOW = -55 oC for HCC device: -40 oC for HCF device. * THIGH = +125 oC for HCC device: +85 oC for HCF device. The Noise Margin for both "1" and "0" level is: 1V min. with VDD = 5 V, 2 V min. with VDD = 10 V, 2.5 V min. with VDD = 15 V
4/13
HCC/HCF4095B HCC/HCF4096B
DYNAMIC ELECTRICAL CHARACTERISTICS (Tamb = 25 o C, C L = 50 pF, RL = 200 K, o typical temperature coefficent for all VDD values is 03 %/ C, all input rise and fall times= 20 ns)
Symbol tPLH tPHL tPLH tPHL tTHL tTLH fCL Parameter Propagation Delay Time Test Conditions VDD (V) 5 10 15 5 10 15 5 10 15 5 10 15 5 10 15 5 10 15 5 10 15 5 10 15 Min. Value Typ. 250 100 75 150 75 50 100 50 40 7 16 24 70 30 20 Max. 500 200 150 300 150 100 200 100 80 Unit
ns
Propagation Delay Time (Set or Reset) Transition Time
ns
ns
Maximum Clock Input Frequency
tW
Clock Pulse Width
3.5 8 12 140 60 40
MHz
ns 15 5 5
tr tf
Clock Input Rise or Fall Time
s
tW
Set or Reset Pulse Width
tsetup
Data Setup Time
200 100 50 400 160 100
100 50 25 200 80 50
ns
ns
Typical Output Low (sink) Current Characteristics
Minimum Output low (sink) Current Characteristics
5/13
HCC/HCF4095B HCC/HCF4096B
Typical Output High (source) Current Characteristics Minimum Output High (source) Current Characteristics
Typical Propagation Delay Time vs Load Capacitance
Typical Transition Time vs Load Capacitance
Typical Clock Frequency vs Supply Voltage (Toggle Mode)
Typical Power Power Dissipation Vs. Input Clock Frequency
6/13
HCC/HCF4095B HCC/HCF4096B
TYPICAL APPLICATIONS T-type Flip-Flop D-type Flip-Flop
Synchronous Binary Divide by Ten Counter
STATE 0 1 2 3 4 5 6 7 8 9
QA 0 1 0 1 0 1 0 1 0 1
QB 0 0 1 1 0 0 1 1 0 0
QC 0 0 0 0 1 1 1 1 0 0
QD 0 0 0 0 0 0 0 0 1 1
NOTE: In all 4095B units the Set and Reset are Connected to VSS
7/13
HCC/HCF4095B HCC/HCF4096B
WAVEFORMS Propagation Delay, Transition and Setup Time Clock Pulse Rise and Fall Time
TEST CIRCUITS Quiescent Device Current. Noise Immunity.
Input Leakage Current.
8/13
HCC/HCF4095B HCC/HCF4096B
Plastic DIP14 MECHANICAL DATA
mm MIN. a1 B b b1 D E e e3 F I L Z 1.27 3.3 2.54 0.050 8.5 2.54 15.24 7.1 5.1 0.130 0.100 0.51 1.39 0.5 0.25 20 0.335 0.100 0.600 0.280 0.201 1.65 TYP. MAX. MIN. 0.020 0.055 0.020 0.010 0.787 0.065 inch TYP. MAX.
DIM.
P001A
9/13
HCC/HCF4095B HCC/HCF4096B
Ceramic DIP14/1 MECHANICAL DATA
mm MIN. A B D E e3 F G H L M N P Q 7.8 2.29 0.4 1.17 0.22 1.52 0.38 15.24 2.79 0.55 1.52 0.31 2.54 10.3 8.05 5.08 0.307 0.090 0.016 0.046 0.009 0.060 3.3 0.015 0.600 0.110 0.022 0.060 0.012 0.100 0.406 0.317 0.200 TYP. MAX. 20 7.0 0.130 MIN. inch TYP. MAX. 0.787 0.276
DIM.
P053C
10/13
HCC/HCF4095B HCC/HCF4096B
SO14 MECHANICAL DATA
DIM. MIN. A a1 a2 b b1 C c1 D E e e3 F G L M S 3.8 4.6 0.5 8.55 5.8 1.27 7.62 4.0 5.3 1.27 0.68 8 (max.) 0.149 0.181 0.019 8.75 6.2 0.35 0.19 0.5 45 (typ.) 0.336 0.228 0.050 0.300 0.157 0.208 0.050 0.026 0.344 0.244 0.1 mm TYP. MAX. 1.75 0.2 1.65 0.46 0.25 0.013 0.007 0.019 0.003 MIN. inch TYP. MAX. 0.068 0.007 0.064 0.018 0.010
P013G
11/13
HCC/HCF4095B HCC/HCF4096B
PLCC20 MECHANICAL DATA
mm MIN. A B D d1 d2 E e e3 F G M M1 1.27 1.14 7.37 1.27 5.08 0.38 0.101 0.050 0.045 9.78 8.89 4.2 2.54 0.56 8.38 0.290 0.050 0.200 0.015 0.004 TYP. MAX. 10.03 9.04 4.57 MIN. 0.385 0.350 0.165 0.100 0.022 0.330 inch TYP. MAX. 0.395 0.356 0.180
DIM.
P027A
12/13
HCC/HCF4095B HCC/HCF4096B
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use ascritical components in life support devices or systems without express written approval of SGS-THOMSON Microelectonics. (c) 1994 SGS-THOMSON Microelectronics - All Rights Reserved SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A
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